Customer Brief: Xan3D

Xan3D Technologies Hybrid IC processes can compress what are today's modules, and even systems, down to individual chips. The company's first commercial application was a Single Chip Optoelectronic Transceiver which could do the work of 1,250 Ethernet Cards.

The company's Para-Optix product line delivers even more power and functionality in a package with a footprint smaller than a postage stamp. This is where Xan3D engineer Roger Dugas was most put to the test. Preliminary design evaluations done in CFdesign revealed that traditional heat sink configurations simply could not do the job. With a maximum case height of less than 12.5 mm, neither the standard fin nor pin fin designs could keep the maximum case temperature below 80° C.

Feeling he was between a rock and a hard place, Dugas strapped on his running shoes and went for some exercise and fresh air in hopes of finding a breakthrough. Somewhere along the way he imagined a solid block of heat sink material drilled with dozens of holes from every side, looking like a small bite of Swiss cheese. He ran back to the office, built a model of this "Inside-Out", or what is now referred to as an I/O heat sink in SolidWorks, launched a CFdesign analysis and eagerly watched the simulation unfold.

In CFdesign the Xan3D I/O heat sink dramatically outperformed the next best alternative, a small pin fin sink design and even satisfied all design parameters. Physical prototyping and testing verified the new design and Xan3D has since been awarded important design patents on their innovative approach.

Dugas says the revolutionary heat sink simply wouldn't have been possible without access to a rapid digital prototyping environment. "Working within SolidWorks and CFdesign I was able to look at 41 different design variations in a short amount of time. Not only was I able to prove the I/O concept but CFdesign's Design Review and Communication Centers allowed me to efficiently collaborate with the entire Para-Optix design team and our customers."